Fujitsu Microelectronics Ltd, e-Shuttle and D2S have come together to create a design for e-beam (DFEB) technology. The design will include a 65nm low power library and would result in the development of test silicon to authenticate DFEB technology.

Isn’t it nice to know that e-Shuttle produces test chips using D2S’s advanced DFEB design, software capabilities and FML’s standard cell libraries? These test chips are created using Advantest’s F3000 e-beam direct-write (EBDW) lithography equipment, which is under way at e-Shuttle. Let’s consider the partnership advantageous because FML can now manufacture ICs faster and cheaper than with traditional EBD lithography technologies. The D2S’s advanced DFEB technology optimises the existing e-beam technology of F3000 from Advantest and not depending on a lithography breakthrough. By smartly applying the EBDW approach, DFEB technology wards away the cost of masks and can hasten availability by decreasing the process flow.

DFEB technology can have an impact on specific application fields like computing and also companies producing test chips, engineering samples and design derivatives.

Via: Techon